CFETs are future stacked transistors: a p-channel and n-channel field-effect transistor stacked vertically. Intel, Samsung, and TSMC are building both the top and bottom devices at the same time. IBM has committed to a sequential construction process. https://spectrum.ieee.org/cfet-ibm-plan?utm_source=mastodon&utm_medium=social&utm_campaign=fedica-Mastodon-Daily-Pipeline